CIS

ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

AUTOPIA

Automatic Active Alignment System (for Automotive Camera Application)

COSMOS

Automatic 3D Sensing Alignment System

Eagle AERO

For High-end IC Applications

IS600D

Automatic Active Alignment Bonding System (for Dual-Camera Module Assembly)

Lens Holder Attach System

IS600GS

Automatic Active Alignment Bonding System for Camera Module Assembly

Lens Holder Attach System

IS868LA3

Automatic Lens Holder Attach System

DI-water Cleaning System

ISCM868S

Automatic DI-Water Cleaning System

ISLinDA

Automatic Die Bonding System (12” wafer handling)

Ball Bonder OPTO/LED Wire Bonding Equipment

Harrier Xtreme

Dual-Head Extreme High Speed Wire Bonder

OPTO/LED Wire Bonding Equipment

iHawk Xpress XL

Wire Bonder

Ball Bonder OPTO/LED Wire Bonding Equipment

iHawk Xtreme

Wire Bonder

Strip Form Substrates AOI System

VIM300 / IS-VIM300

Automated Optical Inspection

Other Applications