Computing

ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

Eagle AERO

For High-end IC Applications

Misc

eClip Plus Series

Automatic Clip Bonding System

FIREBIRD TCB Series

Automatic Thermal Compression Bonding System

Ultrasonic Wedge Bonder

HERCULES

Heavy Aluminum Wire Bonding System

Transfer Molding

IDEALmold™ 3G

Automatic Encapsulation Solution (strip / reel form substrate handling)

ISLinDA

Automatic Die Bonding System (12” wafer handling)

MP-TAB Series

Automatic Trim & Form System

20 Pickheads System

SUNBIRD

Fully Automatic Turret Sorting Handler

AD832i

Automatic Die Bonding System (8” wafer handling)

Laser 1205

UV Grooving System

Laser 1205

UV Dicing System

Other Applications