LEDs

ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

Aluminium Bonder Ultrasonic Wedge Bonder

AB589 Series

Rotary Head Fine Aluminum Wire Bonding System

AD211 Plus II

Automatic Direct Eutectic Die Attach System

AD838L-G2

Automatic Die Attach System

Wafer Form

AS410

Automatic Chip Probing System

Wafer to Tape & Reel

AT420

Automatic LED Taping System

Eagle AERO

For High-end IC Applications

LS100-2

Automatic Laser Scribing System

Wafer Form

MS60

Automatic Map Sorting System

AD100

High Speed Epoxy Die Bonder (for Vertical LED Application)

AD210 Plus

Automatic Die Bonding System (6” wafer handling)

AD830 Plus

Automatic Epoxy Die Attach System (6” wafer handling)

AD830P-Plus

Automatic Die Bonder

Other Applications