MEMs

ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

Eagle AERO

For High-end IC Applications

Transfer Molding

IDEALmold™ 3G

Automatic Encapsulation Solution (strip / reel form substrate handling)

Transfer Molding Compression Molding

ORCAS Manual

Manual Encapsulation Solution

Compression Molding

ORCAS Series

Encapsulation Solution for Large Format Packaging

Ball Bonder IC Wire Bonding Equipment

Eagle Xpress GoCu

High Speed Wire Bonder for Wider Substrate

Special Wire Bonding Equipment

Eagle Xpress GoCu with Automated Conveyor System

High Speed Wire Bonder for Inline Configuration

Ball Bonder OPTO/LED Wire Bonding Equipment

Harrier Xtreme

Dual-Head Extreme High Speed Wire Bonder

Compression Molding

IDEALcompress™

Automatic Encapsulation Solution (strip form substrate handling)

Transfer Molding

IDEALmold™ R2R

Encapsulation Solution

Ball Bonder IC Wire Bonding Equipment

iHawk Xpress Gocu

Wire Bonder

OPTO/LED Wire Bonding Equipment

iHawk Xpress XL

Wire Bonder

Other Applications