ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.
Automatic Die Bonding System (12” wafer handling)
For High-end IC Applications
Automatic Encapsulation Solution (strip / reel form substrate handling)
Manual Encapsulation Solution
Encapsulation Solution for Large Format Packaging
High Speed Wire Bonder for Wider Substrate
High Speed Wire Bonder for Inline Configuration
Dual-Head Extreme High Speed Wire Bonder
Automatic Encapsulation Solution (strip form substrate handling)
Encapsulation Solution
Wire Bonder
Wire Bonder