Mobile Communications

Creating solutions that deliver low power consumption, robustness, reliability, cost-effectiveness and miniaturisation.

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

AUTOPIA

Automatic Active Alignment System (for Automotive Camera Application)

COSMOS

Automatic 3D Sensing Alignment System

Eagle AERO

For High-end IC Applications

FIREBIRD TCB Series

Automatic Thermal Compression Bonding System

Ultrasonic Wedge Bonder

HERCULES

Heavy Aluminum Wire Bonding System

Transfer Molding

IDEALmold™ 3G

Automatic Encapsulation Solution (strip / reel form substrate handling)

Lens Holder Attach System

IS600GS

Automatic Active Alignment Bonding System for Camera Module Assembly

Lens Holder Attach System

IS868LA3

Automatic Lens Holder Attach System

DI-water Cleaning System

ISCM868S

Automatic DI-Water Cleaning System

ISLinDA

Automatic Die Bonding System (12” wafer handling)

MP-TAB Series

Automatic Trim & Form System

Other Applications