Mobile Communications

Creating solutions that deliver low power consumption, robustness, reliability, cost-effectiveness and miniaturisation.

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

Laser 1205

UV Grooving System

Laser 1205

UV Dicingᵖˡᵘˢ System

MP-TAB Series

Automatic Trim & Form System

NUCLEUS Series / NUCLEUS-XL Series

Multi-Purpose Precision Pick & Place Tool

20 Pickheads System

SUNBIRD

Fully Automatic Turret Sorting Handler

AD832i

Automatic Die Bonding System (8” wafer handling)

AUTOPIA

Automatic Active Alignment System (for Automotive Camera Application)

COSMOS

Automatic 3D Sensing Alignment System

Eagle AERO

For High-end IC Applications

FIREBIRD TCB Series

Automatic Thermal Compression Bonding System

Ultrasonic Wedge Bonder

HERCULES

Heavy Aluminum Wire Bonding System

Other Applications