ASMPT well-positioned to leverage high growth of advanced semiconductor packaging with NEXX purchase

Singapore and Hong Kong, 2 October 2018 – ASM Pacific Technology Ltd. (ASMPT), the world leader in semiconductor assembly and packaging equipment, announced that on 1 October 2018 it has completed its acquisition of  TEL NEXX, Inc (NEXX) from Tokyo Electron Limited (TEL). TEL NEXX will be subsumed under the Back-End Equipment segment of ASMPT.

 

The acquisition is another major step by ASMPT in pursuing their strategy of tapping into new high growth markets and expanding their product offerings to the advanced semiconductor packaging market.

 

Established in 2001, NEXX is an industry leader in the advanced packaging market and has strong technological capabilities in the highly specialized Electrochemical Deposition (ECD) and Physical Vapor Deposition (PVD) technologies. Integrating NEXX’s technologies with ASMPT’s broad product range and global support will enable the Group to expand their business portfolio and continue to offer the most innovative solutions to their customers.

 

“With the TEL NEXX acquisition, ASMPT is now uniquely positioned as the integral “Interconnect” company offering a one-stop shop of interconnect solutions in the packaging and surface mount market segments. We can now provide the broadest portfolio of interconnect solutions in the industry. This includes wire bond, flip chip, thermocompression bonding, and together with NEXX’s PVD and ECD equipment, we can offer film interconnect solutions inclusive of UBM (Under Bump Metallization), Cu Pillar (Fine Pitch Copper Pillar), TSV (Through Silicon Via) and RDL (Redistribution Layer), just to name a few,” said Mr Lee Wai Kwong, CEO of ASMPT.

 

Under the new ASMPT’s NEXX organisation, Tom Walsh will remain as ASM NEXX President, reporting to CK Lim, Vice President/Deputy CEO, Back-End Equipment Segment.

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About ASM Pacific Technology Limited

As a global technology and market leader, ASMPT (HKEX stock code: 0522), develops and provides leading edge solutions and materials for the semiconductor assembly and packaging industries. Its surface mount technology solutions are deployed in a wide range of end-user markets including electronics, mobile communications, automotive, industrial, LED and alternative energy. The company’s continuous investments in research and development help to provide its customers with innovative and cost-efficient solutions and systems that enable them to achieve higher productivity, greater reliability and enhanced quality.

Listed on the Hong Kong Stock Exchange since 1989, ASMPT is currently one of the constituent stocks on the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Hong Kong 35 Index and the Hang Seng Global Composite Index. To learn more about ASMPT, please visit its website at www.asmpacific.com.

 

For further information, please contact:

 

Sally Chew
Director, Corporate Communications
Office: +65 6752 6311
Mobile: +65 98392641
Email: sally.chew@asmpt.com