ASMPT Signed Letters Of Intent Worth Over US$300 Million At CIIE

Shanghai, People’s Republic of China, 15 November 2019 – ASM Pacific Technology Ltd. (ASMPT), the world leader in semiconductor assembly and packaging solutions, equipment and materials, announced that several customers have issued a Letter of Intent (LOI) indicating their intention to purchase semiconductor equipment in the next 12 to 36 months. The LOIs were signed at the China International Import Exhibition (CIIE 2019) which was held in Shanghai on 5 to 10 November 2019.

About ASM Pacific Technology Limited
ASM Pacific Technology, (HKEX stock code: 0522), a global technology and market leader that develops and provides leading-edge solutions in surface mount technology, equipment and materials for the semiconductor assembly and packaging industries.

In 2018, Thomson Reuters listed ASMPT as one of the world’s “Top 100 Global Technology Leaders” and in September 2019, Forbes Asia named ASMPT in its inaugural “Asia’s Best Over A Billion” list which spotlights 200 top-performing listed companies across Asia Pacific with revenues of US$1 billion and over.

Listed on the Hong Kong Stock Exchange since 1989, ASMPT is currently one of the constituent stocks on the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, and the Hang Seng Hong Kong 35 Index. To learn more about ASMPT, please visit its website at www.asmpacific.com.

For further information, please contact:
Brian Fan
Corporate Communications
Office: +65 6750 3134
Email: brian.fan@asmpt.com

Strategic Financial Relations Limited
Mandy Go / Antonio Yu / Rachel Ko
Tel: 2864 4812 / 2114 4319 / 2114 2370
Fax: 2527 1196
Email: mandy.go@sprg.com.hk / antonio.yu @sprg.com.hk / rachel.ko@sprg.com.hk