Products

Latest Product

AD100

High Speed Epoxy Die Bonder (for Vertical LED Application)

Latest Product

AD210 Plus

Automatic Die Bonding System (6” wafer handling)

Latest Product

AD211 Plus

Automatic Direct Eutectic Die Attach System

Latest Product

AD280

Automatic Die Bonding System (6” wafer handling)

Latest Product

AD830 Plus

Automatic Epoxy Die Attach System (6” wafer handling)

Latest Product

AD830P-Plus

Automatic Die Bonder

Latest Product

AD8312 Plus Series

Automatic Die Bonding System (12” wafer handling)

Latest Product

AD832i

Automatic Die Bonding System (8” wafer handling)

Latest Product

AD838L-G2

Automatic Die Bonding System (8” wafer handling)

Latest Product

AD881 Series

Automatic Epoxy Die Bonder

Latest Product Wafer Handling

AD9212 Plus

Automatic Flip Chip Bonding System (12” wafer handling)

Latest Product

AD9312

Automatic Thermocompression Flip Chip System (12” wafer handling)

Latest Product Misc

eClip Plus Series

Automatic Clip Bonding System

Latest Product

ISLinDA

Automatic Die Bonding System (12” wafer handling)

Latest Product

NUCLEUS / NUCLEUS-XL

Multi-Purpose Precision Pick & Place Tool

Latest Product

SD8312

Automatic Soft Solder Die Bonding System

AD830 Plus-R

Automatic Epoxy Die Attach System (6” wafer handling)

TWIN833

Automatic Die Bonder