Encapsulation Solutions

Technology

  • In ASMPT’s Pinnacle Gating System (PGSTM), the Epoxy Molding Compound (EMC) enters from the top and all degating processes are performed within the molding press.
  • SoftecTM is our registered trademark for soft coating technology. It is applied to solve new package challenges for example, in the prevention of bleeding for exposed die, exposed lead and exposed pad.  It also solves cracks in exposed die and ceramic substrate package. It is also a replacement for all types of film assisted molding either before or during encapsulation.

 

Encapsulation Comparative Table

 

Thinner Package

Fine Pitch Wire

Productivity/Cost Saving

Environmentally Friendly

Scalability

Transfer Mold

+++

++

++

+

++

Liquid

++++

++++

+++

++++

++++

Granular

++++

++++

++++

++++

++++

+          Average

++        Above Average

+++     Good

++++   Very Good

 

Compression Molding

  • Compression Molding is about dispensing either liquid or solid encapsulant directly onto the large format substrate. The substrate can be silicon wafer, glass, steel or any material that can withstand molding temperature of minimum of 100°C or above. This concept is to have the encapsulant to come in direct contact with the components such as bump die, wire bond dies, passive etc as this will shorten the material flow path and improves the final product quality.

 

Benefits of Compression Molding

  • Flexibility in design
  • Functionality can be packed into a form factor as small as the die
  • Higher I/O batch processing to lower costs
  • Material efficiency – Go Green!
  • Minimise inventory
  • Handling and shipping logistics can be streamlined
  • Final test can be performed on a large format basis
  • Almost one size fits all encapsulation machines